TSMC confirms purchase of ASML High-NA EUV machines for R&D
TSMC has confirmed it has acquired next-generation High-NA EUV lithography machines from ASML and is currently using them for research and development work. The company stated that it is not abandoning the technology, but is instead building internal expertise before moving toward large-scale deployment.
The clarification came after market speculation that TSMC might delay or limit adoption of the advanced equipment. Each High-NA EUV system costs more than 400 million dollars, making it one of the most expensive tools in semiconductor manufacturing. Earlier industry reports suggested that full production use could be postponed until 2029 due to cost and integration challenges.
Company leadership emphasized that ownership of the machines does not equal immediate mass production use. The equipment is being used in R&D environments to prepare future manufacturing capabilities. Executives indicated that commercial deployment will depend on cost reduction and clearer efficiency gains at scale.
The discussion reflects broader competition in the semiconductor industry as firms race to advance chip miniaturization. ASML continues to position High-NA EUV as a key step for extending chip performance gains. Early production adoption is expected from several industry players, while others continue evaluating timing based on cost and yield considerations.
TSMC also pointed to sustained demand from artificial intelligence applications as a major driver of long-term growth. The company projected 2026 capital expenditure in the range of 52 to 56 billion dollars, while reporting record revenue of 3,810 billion New Taiwan dollars in 2025, a 31.6 percent annual increase. Leadership reaffirmed confidence in its technological position despite competitive pressure from rivals in the global chip industry.
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